PALLADOR 205 WHITE THICKNESS SOLUTION BATH

PALLADOR 205 is a ready-to-use palladium process specifically designed for thick deposits. The PALLADOR 205 process is characterized by the remarkable compactness and resistance of the galvanic layer, which make it suitable both as a pre-rhodium and as an anti-diffusion barrier for gold deposits on copper and its alloys. These characteristics of compactness and resistance greatly reduce the possibility that scratches and abrasions of the final rhodium layer can affect the underlying alloy.